International Symposium: From waste heat to process heat. Heat reintegration and drying optimisation with industrial heat pumps.  
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Logo Ghent University  
Symposium sponsors  
Logo Qpinch  
Logo Qpinch  
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Symposium fees
€ 240 Symposium on 24 May 2016, including documentation, coffee, walking dinner, reception, ...
€ 50 Workshop on 23 May 2016
€ 75 Conference dinner with suprise act on 23 May 2016, attendee partners can join
Sponsor fees
€ 1000 Symposium sponsor (special logo indication on the website and mailings), flag or banner at the entrance, fair participation (each if desired), 2x full symposium participation
€ 250 Logo on symposium website, sessions opening and closing slides (limited), docs or flyer in participants documentation
€ 550 Fair participation (limited space), incl. 1 full symposium entry
Reductions and complimentary registrations
PhD Student with poster €75 for Symposium participation (send short abstract, max 150 words, to
Undergraduate student €75 for Symposium participation ( send copy of student card to
Fair exhibitor Complimentary full symposium and sociocultural event participation for 1 delegate
Full sponsor
Complimentary full symposium and sociocultural event participation for 2 delegates
Deadline, cancellation conditions and payment options
Deadline for registration is Wednesday, 18 May 2016.
Cancellation free of charge is possible until this deadline, thereafter the full amount will be charged.
Payment by Ogone (Mastercard, Visa, Maestro,...) is preferred. Bank transfer is also possible but registration completion will take longer.
  Logo banner SET AIF AIF Cornet EraSME UGENT TEI FLOHEA IZF Cornet W2PHeat PFI ATB Fraunhofer WKI WFK ITV Denkendorf  
  Ing. Bruno Vanslambrouck, project coordinator CORNET HP4Drying, Thermal Energy in Industry (TEI) Research group Ghent University| T +32 56 24 12 27 | E Jolien Kerkhofs, Symposium administrator, Ghent University | T +32 56 24 12 27| E Minh Cuong Tran, Project engineer, Ghent University | T +32 56 24 12 45| E  
  Projects: 2014 Symposium: 2012 Symposium: